Thanks to the latest leaks on Weibo, we have an idea of what the company has in stores for its users.
Qualcomm finally drew the curtains off flagship Snapdragon 845 chip, earlier this month. The chip will be the torch bearer for the company in 2018 and will be used for most forthcoming high end devices.
Qualcomm also produces a variety of chips for different range of smartphones, and thanks to the latest leaks on Weibo, we have an idea of what the company has in stores for its users.
The Snapdragon 670 will be replacing the SD 660 as company’s most dominant mid-tier processor. It will move to a 10nm manufacturing process from 660’s 14nm process. It will have an octa core design with four Kryo 360 cores clocked at 2 GHz and four Kryo 385 cores clocked at 1.6 GHz.. The CPU will be paired by an Adreno 620 GPU.
Devices with Snapdragon 670 will be able to boast one camera up to 26MP or a 13MP + 13MP dual camera setup. It will support LTE Cat 16 with maximum speeds of 1 Gbps download and 150 Mbps upload.
The Snapdragon 640 on the other hand will have a 6+2 core combination. It will pack two Kryo 360 cores clocked at 2.15 GHz and six Kryo 360 cores clocked at 1.55 GHz. Just like the SD670, the 640 will also be made on the 10 nm process and features 1 MB of system cache. The chip will have the same Image Signal Processor (ISP) as the SD670, and will allow the incorporation of a single 26MP or dual 13MP camera setup.
Lastly, the Qualcomm Snapdragon 460 will come with eight cores in total — four Kryo 360 cores clocked at 1.8 GHz and four Kryo 360 cores clocked at 1.4 GHz, but without any system cache. The chip will be built on a 14nm process and device featuring the SD 460 will be able to tuck in a 21MP single camera.