Qualcomm's Snapdragon 670 specifications leaked

Qualcomm’s mid-range Snapdragon chipsets are pretty important for both smartphone manufacturers and consumers. The Snapdragon 660 is currently the flagship midrange chipset and it seems that it might get a successor at this year’s MWC. If we are to believe the latest leaks, the Qualcomm could be soon announcing the Snapdragon 670 chipset.

Leaks from a WinFuture report suggest that the Snapdragon 670 SoC will be manufactured using the 10nm FinFET process, which means that the flagship Snapdragon 600-series will be the first one to join the ranks of the flagship Snapdragon 835 chipset and Samsung’s Exynos 8895 chipset. The 670 is speculated to be a hexa core chipset, i.e it is expected have four modified Cortex A55 cores, which will be called the Kryo 300 silver and focus on sipping power in the most efficient of ways. The other two cores will be based on the performance-focused Cortex A75 cores, which will be termed as Kryo 300 Gold.

The CPU cores have 32Kb of L1 cache, while each cluster has 128Kb of L2 cache and the full package has an additional 1024Kb of L3 cache. The chipset will be assisted by an Adreno 615 GPU, which is expected to post clock speeds of up to 650MHz and can even go up to 700MHz when the situation demands. The Adreno 615 GPU is also expected to support higher resolution dual camera setups than the previous generation chipset.

To provide faster Internet, the new chipset is supposed to use Qualcomm’s X2x modem that will help for speeds up to 1Gbps. The chipset will also support eMMC 5.1 and UFS memory as standard.

The Snapdragon 670 SoC is expected to be unveiled at the MWC 2018 and will soon be expected in premium midrange smartphones of 2018.

(source)